DIAS Automation designs and manufactures advanced equipment for semiconductor assembly. These equipments are used for the packaging of Semiconductor Chip, LED, Solar Cell, SMT Component, Optical Lenses and other micro devices onto a Substrate, Lead Frame, PCB, Flex Circuits etcs. The main product lines include Die Bonder, Wire Bonder, Dispensing and Inspection Systems.
泰时自动系统从事设计及制造先进自动化设备供电子及半导体装配行业，这些设备广泛应用于半导体裸芯片、发光二极管LED、太阳能芯片、微型镜头、等微型元件的组封装制程。公司主要标准产品为 芯片粘片机、超声波焊线机、点胶机、封胶机 及 检验机。公司以香港为基地，并在国内及亚洲各国设有办事处或代理提供有效服务。
