標準產品
貼片機 / 分揀機
DA-750	Automatic Epoxy Die Bonder for up to 200mm wafer
DA-750-300	Automatic Epoxy Die Bonder for up to 300mm wafer
DS-750	Automatic Die Sorter for up to 200mm wafer
DS-750-300	Automatic Die Sorter for up to 300mm wafer
鋁線 / 金線焊機
RB-630	Rotary Head Wedge Bonder for aluminum or gold wire, 200mmx150mm bonding area
點膠機
FC-33-A	Dispensing System with programmable handler for lead frame or substrate products
FC-33-UV	Dispensing System with programmable handler for lead frame or substrate products with post dispense UV curing process
FC-33-M	Dispensing System with manual loading stage and work holder
LD-838	Dispensing System with programmable handler for substrate or carrier mounted devices with pre-heat, post heat, optional multi magazine handler
LD-838-DH	Dispensing System with dual independent XYZ dispensing heads, programmable handler for substrate or carrier mounted devices with pre-heat, post heat, optional multi magazine handler
檢驗機
IS-33-B	Dual Elevator post bond Inspection Station, with programmable XY Table
IS-5-B	Single Elevator post bond Inspection Station, with programmable XY Table
IS-5-M	Single Elevator post bond Inspection Station, with manual XY Table